| A. BENSOUSSAN | THALES Alenia Space (France) |
| J. BISSCHOP | NXP Semiconductors (The Netherlands) |
| G. BUSATTO | University of Cassino (Italy) |
| M. CIAPPA | ETH Zürich (Switzerland) |
| Y. DANTO | IMS, University of Bordeaux (France) |
| I. DE WOLF | IMEC (Belgium) |
| G. ERIKSEN | GRUNDFOS (Denmark) |
| F. FANTINI | University of Modena and Reggio Emilia (Italy) |
| B. FOUCHER | EADS (France) |
| W. GERLING | ECPE (Germany) |
| R. HEIDERHOFF | University of Wuppertal (Germany) |
| H. JACOBS | Infineon (Germany) |
| N. LABAT | IMS, University of Bordeaux (France) |
| J.R. LLOYD | University of Albany (USA) |
| G. MENEGHESSO | University of Padova (Italy) |
| E. MIRANDA | University Autonoma of Barcelona (Spain) |
| J.L. MURARO | THALES Alenia Space (France) |
| G. PAPAIOANNOU | University of Athens (Greece) |
| Ph. PERDU | CNES (France) |
| C. SALM | University of Twente (The Netherlands) |
| N.D. STOJADINOVIC | University of Nis (Serbia) |
| A. TOUBOUL | IMS, University of Bordeaux (France) |
| M. VANZI | University of Cagliari (Italy) |
| W. WONDRAK | Daimler Chrysler (Germany) |
| E. WOLFGANG | ECPE (Germany) |
| Topic A: Quality and Reliability Techniques for Devices and Systems |
| J.BISSCHOP | NXP Semiconductor (The Netherlands) |
| N.D.STOJADINOVIC | University of Nis (Serbia) |
| | |
| Topic B1: Characterisation and Modelling of Failure Mechanisms in Silicon technologies and Nanoelectronics: Hot carriers, high K, gate materials, … |
| E.MIRANDA | University Aut. of Barcelona (Spain) |
| J.STATHIS | IBM Research (USA) |
| | |
| Topic B2: Characterisation and Modelling of Failure Mechanisms in Silicon technologies and Nanoelectronics: low K, Cu Interconnects, … |
| H.JAOUEN | ST Microelectronics (France) |
| A.SCORZONI | University of Perugia (Italy) |
| | |
| Topic B3: Characterisation and Modelling of Failure Mechanisms in Silicon technologies and Nanoelectronics: ESD and Latch-up |
| G.BOSELLI | Texas Instruments (USA) |
| P.PAVAN | University of Modena and Reggio Emilia (Italy) |
| | |
| Topic C1: Advanced Techniques for failure analysis and Case studies: Electron and Optical Beam Testing |
| C.BOIT | TU Berlin (Germany) |
| G.MURA | Sardegna Ricerche (Italy) |
| | |
| Topic C2: Advanced Techniques for failure analysis and Case studies: Other advanced characterisation techniques |
| G.BREGLIO | University of Napoli (Italy) |
| M.BUZZO | Infineon AG (Austria) |
| | |
| Topic D: Failure Mechanisms in Microwave, wide Band-Gap and Photonic Devices |
| D.MARCON | IMEC (Belgium) |
| J.WUERFL | FBH (Germany) |
| | |
| Topic E: Packaging, Assemblies, Passive Components and MEMS |
| I.DE WOLF | IMEC (Belgium) |
| J.IANNACCI | FBK-IRST (Italy) |
| | |
| Topic F: Power, Automotive, Aerospace and Industrial Applications |
| G.BUSATTO | University of Cassino (Italy) |
| E.WOLFGANG | ECPE e.V. (Germany) |
| | |
| Topic G: Reliability of Photovoltaic and Organic devices: Thin Film, concentration, OLED, TFT, … |
| A.CESTER | University of Padova (Italy) |
| C.GERARDI | ST Microelectronics (Italy) |
| Conference Chair: |
| Gaudenzio MENEGHESSO | University of Padova (Italy) |
| Conference Vice-Chair: |
| Massimo VANZI | University of Cagliari (Italy) |
| Technical Programme Chair: |
| Mauro CIAPPA | ETH Zurich (Switzerland) |
| Paolo COVA | University of Parma (Italy) |
| Francesco IANNUZZO | University of Cassino (Italy) |
| Conference Scientific Support: |
| Giovanni BUSATTO | University of Cassino (Italy) |
| Fausto FANTINI | University of Modena and Reggio Emilia (Italy) |
| Enrico ZANONI | University of Padova (Italy) |
| Industrial Exhibition: |
| Francesco IANNUZZO | University of Cassino (Italy) |
| Giovanna MURA | Sardegna Ricerche (Italy) |
| Journal Edition Chairs: |
| Mauro CIAPPA | ETH Zurich (Switzerland) |
| Paolo COVA | University of Parma (Italy) |
| Francesco IANNUZZO | University of Cassino (Italy) |
| Gaudenzio MENEGHESSO | University of Padova (Italy) |
